DiTEC Polishing Compound - Fine Cut - 32oz [PC-CMPD-FCO2]

Description

Polishing Compound - Fine Cut - 32oz

This advanced fine cut, anti-hologram polish removes polishing haze and swirl marks for a 100% hologram-free finish. Featuring next-gen, self-grinding alumina abrasives, it's safe for all paint types - fresh, cured, and scratch-resistant. Water-based, silicone- and solvent-free.

Features:

  • Effectively removes holograms
  • Free of solvents and silicone
  • Appearance: Cream/Paste
  • Solubility: N/A
  • pH: 8

Use & Application:

For the DiTEC Fine Cut Compound, we recommend using the DiTEC Red Trapez foam polishing pad.

Application: Apply a sufficient amount of the polishing compound to the polishing pad or to the painted surface. Spread the compound at a low speed (about 1000 rpm) on the defect and at about 1600 rpm using moderate pressure.

Specifications:

  • Type: Restoration & Compounds
  • Box Dimensions: 3"H x 3"W x 10"L WT: 2.35 lbs
  • UPC: 850019168440

Owner's Manual (pdf)
Brochure (pdf)
Product form

Polishing Compound - Fine Cut - 32ozThis advanced fine cut, anti-hologram polish removes polishing haze and swirl marks for a... Read more

SKU: CWR-111384
Barcode: 850019168440

10 in stock

$84.00

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    • Shipped today? Order within: Jul 21, 2026 15:00:00 -0400

    Description

    Polishing Compound - Fine Cut - 32oz

    This advanced fine cut, anti-hologram polish removes polishing haze and swirl marks for a 100% hologram-free finish. Featuring next-gen, self-grinding alumina abrasives, it's safe for all paint types - fresh, cured, and scratch-resistant. Water-based, silicone- and solvent-free.

    Features:

    • Effectively removes holograms
    • Free of solvents and silicone
    • Appearance: Cream/Paste
    • Solubility: N/A
    • pH: 8

    Use & Application:

    For the DiTEC Fine Cut Compound, we recommend using the DiTEC Red Trapez foam polishing pad.

    Application: Apply a sufficient amount of the polishing compound to the polishing pad or to the painted surface. Spread the compound at a low speed (about 1000 rpm) on the defect and at about 1600 rpm using moderate pressure.

    Specifications:

    • Type: Restoration & Compounds
    • Box Dimensions: 3"H x 3"W x 10"L WT: 2.35 lbs
    • UPC: 850019168440

    Owner's Manual (pdf)
    Brochure (pdf)

    Reviews

    DiTEC Polishing Compound - Fine Cut - 32oz [PC-CMPD-FCO2]

    DiTEC Polishing Compound - Fine Cut - 32oz [PC-CMPD-FCO2]

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